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ng .c om Design and Implementation of VLSI Systems Lecture03 cu u du on g th an co CMOS fabrication Lecture 03: CMOS fabrication cu u du on g th an co ng .c om http://www.appliedmaterials.com/HTMAC/animated.html Fabricating one transistor UV light Mask om oxygen exposed photoresist photoresist .c Silicon dioxide Silicon substrate ng Exposed Photoresist Mask-Wafer Coating Alignment and Exposure Photoresist Ionized CF4 gas photoresist oxide Ionized oxygen gas oxide th an co Oxidation (Field oxide) oxygen Scanning ion beam G ox S D Ion Implantation Photoresist Remove cu u Oxide Etch du on g gate oxide S G Oxidation (Gate oxide) silicon nitride Dopant gas Active Regions S G D Nitride Deposition Photoresist Develop Ionized CCl4 gas Silane gas polysilicon Polysilicon Deposition Contact holes top nitride D oxide oxide Polysilicon Mask and Etch Metal contacts S G D G drain D S Contact Etch Metal Deposition and Etch cu u du on g th an co ng .c om Top view Source Gate Drain Polysilicon Source Gate Drain Polysilicon SiO2 SiO2 p+ p+ n bulk Si n+ n+ p bulk Si cu u du on g th an co ng .c om Wafer preparation cu u du on g th an co ng .c om Start with P substrate cu u du on g th an co ng .c om 1. Spin Resist Coating https://fb.com/tailieudie

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